DSASW0041961.pdf by Amkor Technology

Partial File Text Copper pillar bump is a next generation flip chip interconnect which offers advantages in many designs while meeting current and future ROHS requirements. It is an excellent interconnect choice for
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

DSASW0041961.pdf preview

Download Datasheet

User Tagged Keywords

1000X amkor amkor Cu pillar amkor flip Amkor Technology copper pillar bump cu pillar f2f chip FCCSP flip chip Flip Chip Substrate led flip-chip pillar