The recommended PCB footprint for the 150060GS84000 is a rectangular pad with dimensions of 12.5 mm x 6.5 mm, with a 1.5 mm x 1.5 mm thermal pad in the center.
To ensure proper thermal management, it is recommended to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and to design the PCB with adequate thermal vias and heat sinks.
The maximum operating temperature range for the 150060GS84000 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
Yes, the 150060GS84000 is designed to withstand high-vibration environments, with a vibration resistance of up to 10 G (10-2000 Hz) according to IEC 60068-2-6.
The recommended soldering profile for the 150060GS84000 is a peak temperature of 260°C, with a dwell time of 30-60 seconds, and a cooling rate of 4°C/s.