150120GS75000 datasheet by Wurth Elektronik

150120GS75000 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the 150120GS75000?
  The recommended PCB footprint for the 150120GS75000 is a rectangular pad with dimensions of 12.5 mm x 7.5 mm, with a 1.5 mm diameter hole in the center for the component's pin.
• How do I ensure proper thermal management for the 150120GS75000?
  To ensure proper thermal management, it is recommended to provide a thermal pad on the PCB with a minimum size of 10 mm x 10 mm, and to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK.
• What is the maximum operating temperature range for the 150120GS75000?
  The maximum operating temperature range for the 150120GS75000 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
• Can I use the 150120GS75000 in a high-vibration environment?
  Yes, the 150120GS75000 is designed to withstand high-vibration environments, with a vibration resistance of up to 10 G (10-2000 Hz) according to IEC 60068-2-6.
• What is the recommended soldering profile for the 150120GS75000?
  The recommended soldering profile for the 150120GS75000 is a peak temperature of 260°C, with a dwell time of 30-45 seconds above 217°C, and a cooling rate of 4°C/s max.