Murata recommends a land pattern with a minimum pad size of 1.3mm x 1.3mm and a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and minimize thermal resistance.
To minimize high frequency noise and EMI, use a ground plane under the component, keep the component away from noise sources, and use a shield or enclosure if necessary. Additionally, consider using a common-mode choke or EMI filter in the circuit design.
The 15222C is rated for operation from -40°C to +125°C, but derating is required above 85°C. Consult the datasheet for specific derating curves and guidelines.
Yes, the 15222C is designed to withstand vibrations up to 10G (10Hz to 2kHz) and 6G (2kHz to 10kHz) according to IEC 60068-2-6. However, it's essential to ensure proper mounting and soldering to prevent mechanical stress and damage.
To ensure reliability and longevity, follow proper storage and handling procedures, avoid excessive thermal stress, and use a clean and dry assembly environment. Additionally, consider implementing a burn-in or reliability testing program to detect any potential defects or weaknesses.
