DSASW00416673.pdf by White Electronic Designs

Partial File Text W3E64M72S-XSBX Application Note W3E64M72S-XSBX PACKAGE CONSTRUCTION + QUALIFICATION ENCAPSULANT TEST The encapsulant is not injection molded to control wire sweep effects TG = 150°C Moistu
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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