The recommended PCB footprint for the 2N6661-E3 is a standard SOT-23 package with a minimum pad size of 0.8mm x 0.8mm and a maximum pad size of 1.2mm x 1.2mm, with a thermal pad size of 2.5mm x 2.5mm.
To ensure reliable operation of the 2N6661-E3 in high-temperature environments, it is recommended to derate the power dissipation according to the thermal derating curve provided in the datasheet, and to ensure good thermal conduction to the PCB and heat sink.
The maximum safe operating area (SOA) for the 2N6661-E3 is not explicitly stated in the datasheet, but it can be estimated based on the maximum ratings and thermal characteristics provided. As a general rule, it is recommended to operate the transistor within the recommended operating conditions to ensure reliable operation.
While the 2N6661-E3 can be used as a switch, it is not recommended for high-frequency applications due to its relatively high transition frequency (ft) of 100 MHz. For high-frequency applications, a transistor with a higher ft is recommended.
To handle ESD protection when handling the 2N6661-E3, it is recommended to follow standard ESD handling procedures, such as using an ESD wrist strap, ESD mat, and ESD-safe packaging and storage.
2N6661-E3 datasheet
by Vishay Siliconix
