The thermal resistance of the 39D108G075JP6 is 150°C/W, which means it can dissipate heat efficiently and maintain its performance even in high-temperature environments.
Yes, the 39D108G075JP6 is suitable for high-frequency applications due to its low inductance and high-frequency stability, making it an ideal choice for RF and microwave circuits.
Yes, the 39D108G075JP6 is designed to withstand high-vibration environments, with a vibration rating of 10-2000 Hz, 1.5 mm amplitude, and 3 axes, making it suitable for applications in harsh environments.
Yes, the 39D108G075JP6 is compatible with lead-free soldering processes, with a melting point of 260°C, making it suitable for RoHS-compliant and environmentally friendly designs.
The recommended land pattern for the 39D108G075JP6 is a rectangular pad with a minimum size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape, to ensure reliable soldering and minimize thermal stress.
