Murata recommends a land pattern with a minimum pad size of 1.3mm x 1.3mm and a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and minimize thermal resistance.
To minimize high frequency noise and EMI, use proper PCB layout techniques such as grounding, shielding, and decoupling. Additionally, consider using EMI filters or common-mode chokes in the circuit design.
The 48221SC is rated for operation from -40°C to +125°C, but derating may be necessary for high-temperature applications. Consult the datasheet and Murata's application notes for specific guidance.
The 48221SC is designed to withstand moderate vibration levels, but extreme vibration may affect its performance and reliability. Consider using vibration-dampening materials or mounting techniques to minimize the impact of vibration.
To ensure reliability in high-humidity environments, follow proper storage and handling procedures, and consider using conformal coating or potting compounds to protect the component from moisture.