DSA0027398.pdf by STMicroelectronics

Partial File Text AN577 APPLICATION NOTE PACKAGING AND SOLDERING METHOD DEVICES IN SMA, SMB AND SMC PACKAGE PACKING Devices in SMA, SMB and SMC package are delivered in standard embossed 12 & 16 mm tape and reel
Datasheet Type Original
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AN577 CECC00802 iec 286-3 stmicroelectronics