DSAUPLD00004037.pdf
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- 1 2 3 4 5 6 7 8 PCB STACK UP LAYER 1 : TOP LAYER 2 : SGND1 A LE5 BLOCK DIAGRAM(module) CPU Merom 478P (uPGA)/35W PAG 3,4 CPU THERMAL SENSOR 14.318MHz 01 A LAYER
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