DSAE0069173.pdf by Intel

Partial File Text 2 2 Package/Module/PC Card Outlines and Dimensions 1/20/97 6:33 PM CH02LINK.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 2 PACKAGE/MODULE/PC CARD OUTLINES AND DIME
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

DSAE0069173.pdf preview

Download Datasheet

User Tagged Keywords

23136 231369 64 CERAMIC LEADLESS CHIP CARRIER LCC Braze Dual-In-Line 16 Packages CERAMIC LEADLESS CHIP CARRIER CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE intel 945 INTEL CDIP 28 PIN INTEL CDIP 40 PIN intel pin grid array package outline of the heat slug for JEDEC PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC QFP 128 lead .5mm QFP 64 Cavity package Side Brazed Ceramic Dual-In-Line Packages Side Brazed Ceramic Dual-In-Line Packages 28