DSA0095585.pdf by Texas Instruments

Partial File Text Application Report SPRA429A TMS320C6000 BGA Manufacturing Considerations David Bell C6000 Applications Team Abstract When designing with a high-density BGA package, it is important to be
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0.35mm BGA fanout 0.65mm pitch BGA BGA Package 0.35mm pitch BGA reflow guide BGA Solder Ball 0.35mm C6000 SSYZ015 TMS320C6000 TMS320C6202