DSA0019424.pdf by Motorola

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20 pins qfn 4x4 footprint 24 leads qfn 5x5 28 pins qfn 7x7 footprint 32 pins qfn 5x5 footprint 4914 smd 4x4 mm pkg, 0.5mm pad pitch JEDEC MO-220 Compliant AN1902 BD 4914 C 2958 double sided pcb, thermal via EIA and EIAJ standards 783 EIA-783 EIA-783 Freescale FR4 epoxy pcb double sided freescale QFN 32 5x5 footprint freescale QFN 64 8x8 footprint JEDEC JESD51-8 BGA jedec package MO-220 0.4 pitch jedec package MO-220 32 5x5 JEDEC QFN case outline L01 QFN-6 land pattern BGA 0.75 land pattern BGA 0.75 freescale MO-220 MO-220 7x7 0.4 pitch MO-220 8x8 Motorola MAP QFN PCB design for very fine pitch csp package qfn 32 land pattern qfn 44 7x7 PACKAGE footprint qfn 44 PACKAGE footprint 7x7 qfn 44 PACKAGE footprint 7x7 DIe Size QFN 48 7x7 footprint qfn 48 7x7 stencil QFN 56 7x7 footprint qfn 5x5 thermal resistance QFN 64 8x8 dimension QFN 64 8x8 footprint qfn 64 8X8 land pattern QFN 64 9x9 footprint qfn 64 pcb pattern QFN 76 9x9 footprint QFN 7X7 QFN 9X9 QFN 9X9mm QFN PACKAGE Junction to PCB thermal resistance QFN PACKAGE thermal resistance QFN PCB Layout guide QFN-48 thermal resistance qfp 32 land pattern QFP lead pitch 0.3mm Theta-JA 7x7 Theta-JC QFP die down Thin Quad flat package 44 mo-220 Thin Quad flat package mo-220