DSAE0062478.pdf
by Intel

Partial File Text Plastic Pin Grid Array (PPGA) Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements
Datasheet Type Original

DSAE0062478.pdf preview

Download Datasheet

User Tagged Keywords

ceramic pin grid array package wire bond CPGA large cavity heat slug for JEDEC intel pin grid array package outline of the heat sink for JEDEC outline of the heat slug for JEDEC power led heat sink ppga package datasheet