A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Decoupling capacitors should be placed close to the device, and signal traces should be kept short and away from noise sources.
Use controlled impedance traces, minimize signal reflections, and terminate signals properly. Also, use a common clock and data strobe to ensure data alignment and minimize skew.
The device has a thermal pad that must be connected to a solid ground plane for heat dissipation. A thermal interface material can be used to improve heat transfer between the device and the PCB.
Power sequencing should be done in a specific order to prevent damage to the device. The recommended sequence is VCC, then VCCQ, and finally VREF. Voltage ramp-up should be done slowly to prevent inrush currents.
The device has internal ESD protection, but external protection is still recommended. Use ESD protection devices, such as TVS diodes, and follow proper handling and storage procedures to prevent ESD damage.
65LBC174AM16DWREP datasheet
by Texas Instruments
