Texas Instruments provides a recommended PCB layout and thermal management guide in the '66AK2H12DAAW2 PCB and Thermal Design Guide' document. It's essential to follow these guidelines to ensure optimal performance, reduce thermal issues, and prevent damage to the device.
To minimize power consumption, configure the device to use the lowest possible clock frequency, disable unused peripherals, and use the power-saving features such as dynamic voltage and frequency scaling (DVFS) and low-power modes. Refer to the '66AK2H12DAAW2 Power Management Guide' for more information.
For high-reliability or safety-critical applications, consider using the device in a fault-tolerant configuration, implementing error correction mechanisms, and following the guidelines outlined in the '66AK2H12DAAW2 Reliability and Safety Manual'. Additionally, consult with Texas Instruments' support team for specific guidance and recommendations.
To ensure EMC and EMI compliance, follow the guidelines outlined in the '66AK2H12DAAW2 EMC and EMI Design Guide'. This includes using proper shielding, filtering, and grounding techniques, as well as minimizing noise generation and susceptibility.
The 66AK2H12DAAW2 is rated for operation up to 105°C. However, high temperatures can affect the device's performance, reliability, and lifespan. Consult the '66AK2H12DAAW2 Temperature and Reliability Guide' for specific guidance on thermal management, derating, and reliability considerations.
66AK2H12DAAW2 datasheet
by Texas Instruments
Findchips
