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    DSA00338040.pdf
    by Winbond Electronics

    • Quality and Reliability Report 8.1 Device Reliability Test Data ­ SRAM, LOGIC, EPROM Hot Carrier Effect Test 1. SRAM Processes 1.1 0.4µm/3.3V SRAM DPDM Process 1st Qual. Lot Life Time 2nd Q
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