DSAZSAA00020476.pdf by NXP Semiconductors

Partial File Text PC board footprint NXP Semiconductors Footprint for reï¬ow soldering of HSOP16F package SOT834-1 sr +0.075 mm around copper 1.45 (4 Ã) 0.60 (10 Ã) 11.78 8.86 6.82 4.78 2.74 1.2
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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