DSAZSAA00020473.pdf by NXP Semiconductors

Partial File Text PC board footprint NXP Semiconductors Footprint for reï¬ow soldering of HSOP16 package sr â0.075 mm around copper 0.40 SOT822-1 sr +0.075 mm around copper 1.60 (4 Ã) 0.6
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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DSAZSAA00020473.pdf preview Download Datasheet