DSAZSAA00020340.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of LQFP48 package SOT313-2 Hx Gx P2 Hy (0.125) P1 Gy By Ay C D2 (8Ã) D1 Bx Ax Generic fo
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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