DSAZSAA00020302.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted package; 4 leads SOT143B 3.25 0.6 (3Ã) 0.5 (3Ã) 1.9 0.7 0.6 (3Ã) (3Ã) 2 0.7 0
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
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