DSAZSAA00020238.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of LGA274 package SOP022-1 Hx A1 index area P P 0.8(1) 0.7(2) 28.8 Hy The stencil thickness is 0.1
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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