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    DSAZSAA00020235.pdf by NXP Semiconductors

    • Reflow soldering footprint Footprint information for reflow soldering of leadless ultra small plastic package; 2 terminals SOD882 1.3 0.7 R0.05 (8×) 0.6 0.7 0.8 (2×) (2×) (2×) 0.
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