DSAZSAA00020082.pdf by NXP Semiconductors

Partial File Text Bare die outline Bare die; 84 bond pads; 2.856 x 2.856 x 0.738 mm TDA19988AU D 84 66 1 65 e x 0 E 0 y 43 22 23 42 X Y P1 P2 P4 P3 A A2 A1
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