DSAZSAA00020059.pdf by NXP Semiconductors
- Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 4 x 4 x 0.8 mm A B D SOT969-1 ball A1 index area E A A2 A1 detail X e1 1/2 e รข
- Original
- Unknown
- Unknown
- Unknown
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