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    DSAZSAA00019852.pdf by NXP Semiconductors

    • Package outline LBGA208: plastic low profile ball grid array package; 208 balls; body 17 x17 x 1 mm A B D SOT774-2 ball A1 index area E A A2 A1 detail X e1 e ∅v
    • Original
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    DSAZSAA00019852.pdf preview

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