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    DSAZSAA00019723.pdf by NXP Semiconductors

    • Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-6 terminal 1 index area E A A1 c
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    DSAZSAA00019723.pdf preview

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