DSAZSAA00019712.pdf by NXP Semiconductors

Partial File Text Package outline HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm SOT616-4 B D A D1 terminal 1 index area E1 A E
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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