DSAZSAA00019710.pdf by NXP Semiconductors

Partial File Text Package outline HLQFP144: plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad SOT612-4 c y exposed die pad X Dh A 108 7
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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