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    DSAZSAA00019703.pdf by NXP Semiconductors

    • Package outline SDIP64: plastic shrink dual in-line package; 64 leads (750 mil); face down SOT274-2 seating plane D ME A2 A L A1 e Z w b1 M c (e1) MH b 1 3
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    DSAZSAA00019703.pdf preview

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