DSAZSAA00019569.pdf by NXP Semiconductors

Partial File Text Package outline HVQFN54R: plastic thermal enhanced very thin quad flat package; no leads; 54 terminals; resin based; body 5.5 x 10 x 0.8 mm A B D SOT1198-1 terminal 1 index area E
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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