DSAZSAA00019477.pdf by NXP Semiconductors
- Package outline WLCSP16: wafer level chip-size package; 16 bumps; 1.96 x 1.96 x 0.54 mm A B D NX20P3000UK ball A1 index area A2 E A A1 detail X e1 C e C A B C
- Original
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