DSAZSAA00019474.pdf by NXP Semiconductors
- Package outline WLCSP24: wafer level chip-size package; 24 bumps; 2.11 x 2.11 x 0.61 mm A B D IP3338CX24/LF bump A1 index A2 E A A1 detail X e1 e b E e D e2 C
- Original
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