DSAZSAA00019473.pdf by NXP Semiconductors

Partial File Text Package outline WLCSP18: wafer level chip-size package; 18 bumps; 2.06 x 1.66 x 0.61 mm A B D IP3337CX18/LF bump A1 index A2 E A A1 detail X e1 e b D e C e2 B A
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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