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Package outline
WLCSP18: wafer level chip-size package; 18 bumps; 2.06 x 1.66 x 0.61 mm
A
B
D
IP3337CX18/LF
bump A1
index
A2
E
A
A1
detail X
e1
e
b
D
e
C
e2
B
A
