Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAZSAA00019473.pdf by NXP Semiconductors

    • Package outline WLCSP18: wafer level chip-size package; 18 bumps; 2.06 x 1.66 x 0.61 mm A B D IP3337CX18/LF bump A1 index A2 E A A1 detail X e1 e b D e C e2 B A
    • Original
    • Unknown
    • Unknown
    • Unknown
    • Find it at Findchips.com

    DSAZSAA00019473.pdf preview

    Price & Stock Powered by
    Supplyframe Tracking Pixel