DSAZSAA00019013.pdf by NXP Semiconductors

Partial File Text Package outline HSQFP240: plastic, heatsink shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm SOT464-1 c y X 180 121 120 181 e E HE A A2 A1 (A 3) Î¸ w
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
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