The recommended PCB footprint for the 82541300 can be found in the Wurth Elektronik's PCB Library or in the component's 3D model. It's essential to follow the recommended footprint to ensure proper soldering and thermal management.
The thermal pads on the 82541300 should be connected to a solid ground plane on the PCB to ensure efficient heat dissipation. A thermal via or a copper pour connected to the ground plane is recommended.
The maximum operating temperature range for the 82541300 is -40°C to +125°C. However, it's essential to consider the derating curves and thermal management to ensure reliable operation within the specified temperature range.
The 82541300 is designed to withstand moderate vibration levels. However, for high-vibration environments, it's recommended to use additional mechanical support or consider a more ruggedized component. Consult with Wurth Elektronik's technical support for specific guidance.
To ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing loop areas, and using shielding if necessary. Additionally, consider using Wurth Elektronik's EMC-optimized components and following their application notes.
82541300 datasheet
by Wurth Elektronik
