DSA0088922.pdf

Partial File Text The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging Joseph Gauci, Adrian-Michael Borg and Robert Caruana, ST Microelectronics, Malta Keith Whitlaw and Jeff Cros
Datasheet Type Original
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Pb Free Unknown
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adrian borg ALLOY leadframe C7025 c151 lead frame C7025 C7025 strip specification Cu6Sn5 FLUX TYPE ROL0 leadframe C7025 leadframe Cu C194 PDIP-42L smd EDL 63 ST-300 ST-50