DSA00435068.pdf by Xilinx

Partial File Text Application Note: Packaging R Implementation and Solder Reflow Guidelines for Pb-Free Packages XAPP427 (v2.2) January 30, 2006 Summary Recent legislative directives and corporate driven
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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BFG95 BGA PROFILING FFG1148 FFG1152 FFG676 FFG896 FGG256 FGG400 FSG48 Lead Free reflow soldering profile BGA PQG100 PQG160 PQG208 reflow profile 245 reflow soldering profile BGA SOG20 XAPP427

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