DSA00435066.pdf by Xilinx

Partial File Text Application Note: Packaging R Optimizing Solder Reflow Process for Xilinx BGA Packages XAPP425 (v1.0) December 9, 2002 Summary The primary purpose of solder reflow process is to wet the
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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BGA PACKAGE thermal profile BGA PROFILING C-150 Lead Free reflow soldering profile BGA reflow soldering profile BGA reflow temperature bga XAPP425

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