DSA007614.pdf by Alpha & Omega Semiconductor

Partial File Text Document No. DSMT-0003 Rev. 1 Page: 1/1 PCB Land Design and Surface Mount for DFN3x2 and DFN3x3 Punched Packages Introduction DFN package is a plastic encapsulated package with a copper lead
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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Alpha Omega cross AON3404 AON3603 AON4404 aon4409 AON4604 AON4605 AON4703 package

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