Texas Instruments provides a layout guide in the datasheet, but it's essential to follow additional best practices, such as keeping analog and digital traces separate, using a solid ground plane, and minimizing signal routing near the ADC inputs. A 4-layer PCB with a dedicated analog ground plane is recommended.
The internal reference voltage can be enabled by setting the REFSEL pin to VREF. The buffer should be enabled by setting the BUFEN pin to VBUF. Ensure that the reference voltage is stable and within the recommended range (1.2V to 1.3V) for optimal performance.
The maximum sampling rate of the ADC3241IRGZT is 65 MSPS. However, the power consumption increases with the sampling rate. At 65 MSPS, the power consumption is approximately 125 mW. To reduce power consumption, consider reducing the sampling rate or using the device's power-down modes.
The ADC3241IRGZT has a latency of 3 clock cycles, and the pipeline delay is 2 clock cycles. This means that the output data is available 3 clock cycles after the conversion starts. Ensure that your system design accounts for this latency and pipelining to avoid data misalignment and ensure correct data processing.
The ADC3241IRGZT has a junction temperature range of -40°C to 125°C. Ensure that the device is operated within this range by providing adequate heat sinking and thermal management. Use thermal simulation tools to estimate the device's temperature and ensure that it remains within the recommended range.
ADC3241IRGZT datasheet
by Texas Instruments
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