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    Part Img ADC3243IRGZR datasheet by Texas Instruments

    • Integrated Circuits (ICs) - Data Acquisition - Analog to Digital Converters (ADC) - ANALOG TO DIGITAL CONVERTERS - A
    • Original
    • Yes
    • Yes
    • Active
    • 3A991.C.4
    • 8542.39.00.01
    • 8542.39.00.00
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    ADC3243IRGZR datasheet preview

    ADC3243IRGZR Frequently Asked Questions (FAQs)

    • Texas Instruments provides a layout and routing guide in the ADC3243 datasheet, which recommends keeping the analog and digital grounds separate, using a solid ground plane, and minimizing trace lengths and loops. Additionally, it's essential to follow good PCB design practices, such as using a star-ground configuration and avoiding vias under the device.
    • The internal reference voltage can be configured using the REFSEL pin. For a 2.5V reference, connect REFSEL to VCC. For a 1.2V reference, connect REFSEL to GND. The internal buffer can be enabled or disabled using the REFBUF pin. Connect REFBUF to VCC to enable the buffer or GND to disable it. Refer to the datasheet for more information on reference voltage and buffer configuration.
    • The maximum sampling rate of the ADC3243IRGZR is 65 MSPS. As the sampling rate increases, power consumption also increases. To minimize power consumption, consider reducing the sampling rate or using the device's power-down modes. The datasheet provides a detailed power consumption vs. sampling rate graph for reference.
    • The ADC3243IRGZR outputs 14-bit or 15-bit digital data, depending on the mode. The recommended data format is twos-complement, with the most significant bit (MSB) first. The datasheet provides a detailed description of the digital output data format and timing diagrams for reference.
    • The ADC3243IRGZR has a maximum junction temperature (TJ) of 150°C. To ensure reliability, it's essential to maintain a safe operating temperature by providing adequate heat dissipation, such as using a heat sink or thermal pad. The datasheet provides thermal resistance and power dissipation information to help with thermal design.
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