A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device's exposed pad should be connected to the ground plane. A detailed layout guide is available in the TI application note 'ADS54RF63IPFP PCB Layout Guidelines'.
To optimize the performance of the ADC's analog input stage, use a low-impedance signal source, minimize the length of the input traces, and use a common-mode filter to reduce noise. Additionally, ensure that the input signal is within the recommended range of 0.5 V to 1.5 V.
The recommended clocking scheme is to use a single-ended clock input with a frequency range of 100 MHz to 1.2 GHz. The clock input should be AC-coupled and terminated with a 50-ohm resistor to ensure proper signal integrity.
The device's power supplies (AVDD, DVDD, and DRVDD) should be powered up simultaneously. The reset pin (RST) should be asserted low for at least 10 ns to ensure proper device reset. The device is ready for operation after the reset pin is de-asserted.
The device's thermal pad should be connected to a heat sink or a thermal land on the PCB. Ensure good thermal conductivity between the device and the heat sink or thermal land. The device's junction temperature should be kept below 125°C to ensure reliable operation.
ADS54RF63IPFP datasheet
by Texas Instruments
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