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    Part Img ADS8512IDW datasheet by Texas Instruments

    • ADS8512 - 12-Bit 40KSPS Low Power Sampling A/D Converter w/IR & Serial Interface 16-SOIC -40 to 85
    • Original
    • Yes
    • Unknown
    • Obsolete
    • 8542.39.00.01
    • 8542.39.00.00
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    ADS8512IDW datasheet preview

    ADS8512IDW Frequently Asked Questions (FAQs)

    • Texas Instruments provides a layout guide in the application note SLAA523, which recommends a 4-layer PCB with a solid ground plane, and careful routing of analog and digital signals to minimize noise coupling. Additionally, it's recommended to use a low-ESR capacitor for the AVDD pin and to keep the analog input traces short and shielded.
    • The ADS8512IDW has an internal calibration circuit that can be used to calibrate the device. The calibration process involves applying a known input voltage and then reading the output code. The difference between the expected and actual output codes can be used to calculate the gain and offset errors, which can then be used to correct the output codes. Texas Instruments provides a calibration procedure in the application note SLAA524.
    • The maximum sampling rate of the ADS8512IDW is 200 kSPS. However, the power consumption increases with the sampling rate. At 200 kSPS, the power consumption is typically around 15 mW, while at 100 kSPS, it's around 10 mW. The power consumption can be reduced by using the power-down mode, which reduces the power consumption to around 1 μW.
    • The ADS8512IDW can be interfaced with a microcontroller using a serial interface, such as SPI or I2C. The key considerations for the interface design include ensuring that the microcontroller can handle the data transfer rate, using a suitable clock frequency, and implementing a protocol for data transfer and error checking. Texas Instruments provides example code and interface diagrams in the application note SLAA525.
    • The ADS8512IDW has a maximum operating temperature range of -40°C to 125°C. The device's accuracy and reliability can be affected by temperature variations, which can cause changes in the internal reference voltage and amplifier offsets. To minimize thermal effects, it's recommended to use a thermally conductive package, such as the QFN package, and to ensure good thermal dissipation in the system design.
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