AFBR-5921ALZ datasheet by Avago Technologies

AFBR-5921ALZ Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and thermal management for optimal performance of AFBR-5921ALZ?
  A 4-layer PCB with a solid ground plane and a thermal pad connected to a heat sink is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
• How do I ensure reliable operation of AFBR-5921ALZ in high-temperature environments?
  Implement a thermal management system, such as a heat sink or fan, to maintain a junction temperature below 125°C. Also, ensure a stable power supply and minimize power consumption during high-temperature operation.
• What are the ESD protection and handling precautions for AFBR-5921ALZ?
  Handle the device with an anti-static wrist strap or mat. Store the device in an anti-static bag or container. Avoid touching the device's pins or exposing it to electrostatic discharge.
• Can I use AFBR-5921ALZ in a non-IEEE 802.3bt application?
  While designed for IEEE 802.3bt, AFBR-5921ALZ can be used in other applications with proper design and testing. However, ensure compliance with relevant safety and regulatory standards.
• What is the recommended power-up sequence for AFBR-5921ALZ?
  Power up the device in the following sequence: VCC, then VEE, and finally the input signals. Ensure a monotonic power-up sequence to prevent latch-up or damage.