A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The component should be placed near the edge of the board to minimize signal reflections.
The device requires a bias voltage of 3.3V ± 10% and a bias current of 10mA ± 10%. Ensure the bias circuitry is designed to provide a stable voltage and current.
A heat sink with a thermal resistance of ≤ 10°C/W is recommended. Ensure good thermal contact between the device and the heat sink using a thermal interface material.
Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check the power supply voltage, bias voltage, and temperature to ensure they are within the recommended operating conditions.
The ALM-11236-TR1G is a commercial-grade device and may not meet the requirements for high-reliability or aerospace applications. Consult with Broadcom Limited for availability of a qualified version or alternative devices.