A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and crosstalk.
Use a thermal pad or thermal interface material to ensure good thermal contact between the device and the PCB. Also, ensure that the PCB is designed to minimize thermal gradients and hotspots.
Use 0.1uF to 1uF ceramic capacitors with a voltage rating of 10V or higher, placed as close to the device as possible. Additional bulk capacitors (e.g., 10uF) can be used for further noise reduction.
Ensure that the power supplies are sequenced correctly, with the core voltage (VCC) being applied before the I/O voltage (VCCIO). A power sequencing circuit or a dedicated power management IC can be used to ensure correct sequencing.
Use ESD protection diodes or TVS diodes on the I/O lines, and ensure that the PCB is designed with ESD protection in mind, including the use of ESD-resistant components and connectors.