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    ALM-2812-BLKG datasheet by Avago Technologies

    • RF Amplifiers, RF/IF and RFID, IC AMP LNA WLAN DUAL 12MCOB
    • Original
    • Yes
    • Yes
    • Obsolete
    • EAR99
    • 8542.33.00.01
    • Powered by Findchips Logo Findchips

    ALM-2812-BLKG datasheet preview

    ALM-2812-BLKG Frequently Asked Questions (FAQs)

    • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and crosstalk.
    • Use a thermal pad or thermal interface material to ensure good thermal contact between the device and the PCB. Also, ensure that the PCB is designed to minimize thermal gradients and hotspots.
    • Use 0.1uF to 1uF ceramic capacitors with a voltage rating of 10V or higher, placed as close to the device as possible. Additional bulk capacitors (e.g., 10uF) can be used for further noise reduction.
    • Ensure that the power supplies are sequenced correctly, with the core voltage (VCC) being applied before the I/O voltage (VCCIO). A power sequencing circuit or a dedicated power management IC can be used to ensure correct sequencing.
    • Use ESD protection diodes or TVS diodes on the I/O lines, and ensure that the PCB is designed with ESD protection in mind, including the use of ESD-resistant components and connectors.
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