A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
Use a low-ESR capacitor (e.g., 10uF) close to the power pins, and consider adding a 1uF capacitor in parallel to filter high-frequency noise. Ensure the power supply can provide the required current (up to 1.2A) during peak operation.
Use a 26MHz crystal oscillator with a 1:1 ratio for the CPU clock. For the DDR clock, use a 133MHz clock with a 1:2 ratio. Ensure the clock signals are routed with minimal skew and jitter.
Use a boot mode select pin (BOOTMODE) to configure the boot process. Ensure the boot loader is stored in a reliable storage device (e.g., SPI flash). Implement a watchdog timer to reset the device in case of a boot failure.
Use a DDR3L-1333 or DDR3L-1600 memory module with a 1.35V or 1.5V power supply. Ensure the memory clock is synchronized with the CPU clock, and implement a memory controller with error correction and refresh capabilities.
AM3703CUS100 datasheet
by Texas Instruments
