The recommended power-on sequence is to power up the core voltage (VDD_CORE) first, followed by the I/O voltage (VDD_MPU) and then the DDR voltage (VDD_DDR). This ensures proper power-up and minimizes the risk of latch-up or damage to the device.
To optimize power consumption, use the device's power management features such as dynamic voltage and frequency scaling (DVFS), clock gating, and power gating. Additionally, use low-power modes such as idle and sleep modes when the device is not actively processing data.
The maximum operating temperature range for the AM3874CCYEA80 is -40°C to 90°C. However, it's recommended to operate the device within a temperature range of 0°C to 85°C for optimal performance and reliability.
To ensure signal integrity on the AM3874CCYEA80's high-speed interfaces, follow proper PCB design guidelines, use controlled impedance traces, and add termination resistors as needed. Additionally, use signal integrity analysis tools to simulate and optimize the design.
For the DDR memory interface, use a fly-by topology with a single point-to-point connection between the DDR memory and the AM3874CCYEA80. Route the signals as close to the device as possible, and use a solid ground plane to minimize noise and crosstalk.