The recommended operating temperature range for the AM3892CCYG135 is -40°C to 90°C. However, it's essential to note that the device can operate at temperatures up to 105°C for short periods, but this may affect its reliability and lifespan.
To configure the AM3892CCYG135 for low-power mode, you can use the Power and Sleep Controller (PSC) module to control the power domains and clock frequencies. You can also use the Low-Power Idle (LPI) mode, which reduces power consumption by shutting down unused peripherals and clock domains. Refer to the device's technical reference manual for detailed configuration instructions.
The maximum frequency for the DDR3 interface on the AM3892CCYG135 is 1333 MT/s (megatransfers per second). However, the actual frequency may vary depending on the specific DDR3 memory module used and the system design.
Yes, you can use the AM3892CCYG135 with a non-TI DDR3 memory module, but it's essential to ensure that the module meets the device's electrical and timing requirements. TI recommends using a DDR3 module that is compatible with the JEDEC DDR3 specification and has been validated for use with the AM3892CCYG135.
To implement secure boot on the AM3892CCYG135, you can use the device's Security and Fusion (SAF) module, which provides a secure environment for booting and executing software. You'll need to generate a secure boot image using TI's Secure Boot Tools and configure the SAF module to authenticate the boot image. Refer to the device's security documentation for detailed instructions.
AM3892CCYG135 datasheet
by Texas Instruments
